TetraMem and SK hynix Showcase Successful Technology Collaboration Advancing Memory-Centric AI Computing
TetraMem Inc., a leader in Analog In-Memory Computing (A-IMC) technology, and SK hynix Inc., a global leader in AI memory and semiconductor technologies, today announced the successful completion of a joint technology collaboration, highlighted by the publication of their research paper, “A Memristor-based In-Memory Computing SoC with Efficient Depthwise Convolution,” in Advanced Intelligent Systems. The work has also been selected as the cover feature of the journal, recognizing its technical innovation and potential impact on next-generation AI computing.
TetraMem Announces 22nm Multi-Level RRAM Analog In-Memory Computing SoC Milestone
TetraMem Inc., a Silicon Valley–based semiconductor company developing analog in-memory computing (IMC) solutions, today announced the successful tape-out, manufacturing, and initial silicon validation of its MLX200 platform, a 22nm multi-level RRAM-based analog IMC system-on-chip (SoC).
TetraMem and Academic Partners Demonstrate 700°C RRAM/Memristor Breakthrough, Advancing Path Toward Deep-Space AI Computing
TetraMem Inc. today announced that its academic and research collaborators have demonstrated RRAM (memristor) devices capable of reliable operation at temperatures up to 700°C, marking a major advance in non-volatile memory for extreme-environment computing.
